Features:
- Combines a 570 A thyristor branch and diode branch in one 1800 V SEMIPACK 5 module.
- Transfers semiconductor heat through an aluminium-nitride isolated baseplate to the external heatsink.
- Identifies the exact bare-module variant with order code 230B1785 and legacy number 07898730.
SEMIKRON SKKH 570/18 E controls and rectifies high-current AC power through its paired semiconductor topology.
Pressure contacts carry the main current path while the isolated metal baseplate provides the thermal path to the mounting surface.
The 150 x 60 mm footprint, 52 mm height and bare construction define the mechanical and cooling boundary for installation.
The SEMIKRON SKKH 570/18 E 1800 V 570 A Thyristor/Diode Rectifier Module may still be available for purchase and support from Apter Power beyond End-Of-Life (EOL) by the manufacturer (OEM).
SEMIKRON SKKH 570/18 E 1800 V 570 A Thyristor/Diode Rectifier Module Manuals,Datasheets,Link
Important Notice: Other accessories, manuals, cables, calibration data, software, etc. are not included with this equipment unless listed in the above stock item description. All prices are shown in USD.
Controlled rectifier path
- Thyristor branch: The controlled semiconductor changes conduction according to the external gate circuit.
- Diode branch: The diode completes the documented thyristor/diode rectifier topology.
- Current path: Both semiconductor elements share the SEMIPACK 5 power-module construction.
- Application link: The topology is documented for rectifiers in motor drives, process control and power supplies.
Current and voltage limits
- Rated current: The module is identified by a 570 A current rating.
- Blocking class: This E variant is specified for 1800 V.
- Surge capability: The short-duration surge-current figure is 15,500 A.
- Variant code: Order code 230B1785 ties these ratings to the exact SKKH 570/18 E version.
Baseplate thermal path
- Ceramic isolation: Aluminium-nitride ceramic separates the electrical circuit from the metal baseplate.
- Heatsink interface: Heat leaves the semiconductor assembly through the isolated baseplate into the mounted cooling surface.
- TIM status: This bare variant does not include pre-applied thermal interface material.
- Mounting boundary: The cooling design must account for the complete 150 x 60 mm base footprint.
SEMIPACK 5 construction
- Pressure contacts: Pressure-contact construction forms the internal high-current connections.
- Bare module: The 230B1785 variant is delivered without a lid or pre-applied TIM.
- Physical envelope: The module measures 150 x 60 x 52 mm.
- Identification: Legacy part number 07898730 and UL file E 63 532 support exact-unit verification.