Features:
- Sixteen universal-backplane slots
- PCI and serial buses on one backplane
- 604.291 mm documented backplane length
The IC695CHS016 is the long universal-backplane option for RX3i systems that need a high slot count.
Its dual-bus layout lets supported PCI-based RX3i modules and documented serial-bus modules operate within the same planned base.
Confirm module widths, backplane revision, terminal depth, internal-power demand, and the required cooling space before laying out the enclosure.
The GE IC695CHS016 PACSystems RX3i 16-Slot Universal Backplane is listed as Active / Available from OEM. Contact Apter Power for sourcing and slot-planning support.
GE IC695CHS016 PACSystems RX3i 16-Slot Universal Backplane Manuals, Datasheets, Links
Important Notice: Other accessories, manuals, cables, calibration data, software, etc. are not included with this equipment unless listed in the above stock item description. All prices are shown in USD.
GE IC695CHS016 PACSystems RX3i 16-Slot Universal Backplane Specs
General
- Manufacturer GE
- Model IC695CHS016
- Condition New and Original
- Product Family PACSystems RX3i
Backplane communication paths
- PCI bus: The universal backplane distributes the RX3i PCI bus to supported IC695 modules.
- Serial bus: A serial bus is available for documented IC694 and compatible IC693 modules.
- Slot references: Printed slot numbers support consistent hardware configuration in the engineering project.
- Compatibility: Each module must be checked against the current RX3i supported-hardware tables.
Mechanical allocation
- Slot count: The backplane provides sixteen positions for the planned controller and I/O arrangement.
- Module width: Two-slot CPUs and power supplies consume adjacent physical positions.
- Terminal depth: Extended terminal blocks and cable connectors increase the required enclosure depth.
- Expansion design: Remote or expansion hardware must follow the documented serial-bus architecture.
Cabinet and grounding checks
- Cooling space: Allow 102 mm of clearance around the backplane for airflow.
- Shield bonding: Use the integral grounding bar for module shields and cabinet bonding.
- Power budget: Include 600 mA at 3.3 VDC and 240 mA at 5 VDC in the system calculation.
- Revision check: Confirm the complete IC695CHS016 hardware revision before commissioning.